Also expanded with high quality imaging compact module, such as smart phones and tablets to- Sony will evolve, World of Digital Imaging
※ point press release August 20, 2012 1
Sony Corporation (hereafter Sony) CMOS image sensor "Exmor RS" newly developed recruitment and ※ 1, the world's first structure "stacked" own commercialized (Exmore ares es), shipments sequentially from October I will start. We will expand the three models imaging module that adopts towards such as smartphones and tablets to achieve and compact, high-performance high image quality further, the image of each sensor CMOS image sensor "Exmor RS" stacked 3 and the model, .
Sony has been actively promoting the future, the expansion of the product mix and technological development of CMOS image sensor "Exmor RS" stacked core technology to evolve products, digital imaging, spread the enjoyment of photography easier to use, which is a device Go.
Sony has been actively promoting the future, the expansion of the product mix and technological development of CMOS image sensor "Exmor RS" stacked core technology to evolve products, digital imaging, spread the enjoyment of photography easier to use, which is a device Go.
- The upper photo imaging module "IU135F3-Z" "IU134F9-Z" "IUS014F-Z" (from left)
CMOS image sensor "Exmor RS" stacked lower photo "IMX135" "IMX134" "ISX014" (from left)
Conventional back-illuminated
Structural diagram of a CMOS image sensor
Structural diagram of a CMOS image sensor
Structural diagram of a CMOS image sensor "Exmor RS" stacked
Using the chip signal processing circuit is formed in place of the supporting substrate of the CMOS image sensor back-illuminated, superposed portions pixel pixel backside illumination type is formed thereon, "Exmor RS" is unique " It is a CMOS image sensor that employs a "stacked structure.
Three models of "Exmor RS" commercialized, raised the sensitivity without adding pixels (white) W to pixel (red / green / blue) RGB traditional detract from the quality signal processing technology and to its own devices this The capabilities and "RGBW Coding" You can shoot, set the exposure conditions of the two in the same screen at the time of shooting cleanly at night or a dark room, by appropriate signal processing to the image obtained there, it is a wide dynamic range to generate an image, the features can be vivid in color backlight "(High Dynamic Range) Movie HDR", "IMX134 of 8.08 million pixels" IMX135 "of 13.13 million effective pixel 1/3.06 type, valid for 1/4 is ISX014 "" of 8.08 million effective pixels 1/4 type with built-in camera and signal processing, ".Adoption of "stacked structure", in addition to the high image quality and high performance These were both downsizing.
In addition, each image sensor, auto focus to commercialize imaging module "IU135F3-Z" "IU134F9-Z", "IUS014F-Z" a compact unit with a lens with auto-focus mechanism. Imaging module of these three models, high resolution has been achieved by adopting a newly designed lens, which is optimized for the industry's smallest unit pixel ※ 1 1.12μm. "IU135F3-Z" is the auto focus imaging module that employs a high-resolution lens bright F2.2. "IU134F9-Z" is thin and miniaturization has been achieved (W: 4.2mm ※ 4 8.5x D:: 8.5x H). "IUS014F-Z" is an all-in-one imaging module type with a camera signal processing functions on the image sensor, with built-in auto-focus and image quality adjustment.
Future, actively promote the development of CMOS image sensor "Exmor RS" stacked, towards such as smart spaces embedded imaging module is limited by the increase in the size of the display screen, Sony is taking advantage of the features of the structure "stacked" aim was, the commercialization of imaging modules to achieve high performance and miniaturization, higher image quality, while expanding the product mix, we will continue to respond more to the needs of our customers.
By the mobile device market demand, such as smartphones and tablets is growing rapidly, to strengthen the ※ 2 supply system of CMOS image sensors stacked to achieve both miniaturization and high functionality, Sony is leading the CMOS image sensor consolidate the position, I will continue to lead the industry in the future.
※ In the Nagasaki Technology Center of Sony Semiconductor Co., Ltd. 2, are (dated June 22) announced the implementation of capital investment that aims to increase the production capacity of the CMOS image sensor stacked.
Future, actively promote the development of CMOS image sensor "Exmor RS" stacked, towards such as smart spaces embedded imaging module is limited by the increase in the size of the display screen, Sony is taking advantage of the features of the structure "stacked" aim was, the commercialization of imaging modules to achieve high performance and miniaturization, higher image quality, while expanding the product mix, we will continue to respond more to the needs of our customers.
By the mobile device market demand, such as smartphones and tablets is growing rapidly, to strengthen the ※ 2 supply system of CMOS image sensors stacked to achieve both miniaturization and high functionality, Sony is leading the CMOS image sensor consolidate the position, I will continue to lead the industry in the future.
※ In the Nagasaki Technology Center of Sony Semiconductor Co., Ltd. 2, are (dated June 22) announced the implementation of capital investment that aims to increase the production capacity of the CMOS image sensor stacked.
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※ 3 at low light imaging module "IU135F3-Z" 13.13 million effective pixel 1/3.06 type of (stacked) image of the sample taken (10 lux) (right)
- (※ 3 13.13 million effective pixels) image comparison
- (※ 3 13.13 million effective pixels) "IU135F3-Z"
※ 3 Imaging Module "IU135F3-Z" 13.13 million effective pixel 1/3.06 type image samples (stacked) (right)
- No function "HDR Movie" (on the left)(※ 3 13.13 million effective pixels) image comparison
- Function is "HDR Movie" (on the right)(※ 3 13.13 million effective pixels) "IU135F3-Z"
CMOS image sensor "Exmor RS" stacked Key Features
Commercialization of "Exmor RS" which adopted the newly developed structure "stacked" the world's first own ※ 1 1)
Both functional and compact, high-image quality enhancement by adopting the layered structure 2).
- On-chip ("IMX135", "IMX134") features "HDR Movie" function and "RGBW Coding"
- Built-in camera signal processing function, automatic control, image quality adjustment, a plurality of image output format support (eg YUV) is ("ISX014") can be
Both functional and compact, high-image quality enhancement by adopting the layered structure 2).
- On-chip ("IMX135", "IMX134") features "HDR Movie" function and "RGBW Coding"
- Built-in camera signal processing function, automatic control, image quality adjustment, a plurality of image output format support (eg YUV) is ("ISX014") can be
Major Features imaging module (in each image sensor, equipped with a lens unit with autofocus mechanism)
Achieve high resolution by adopting a newly designed lens, which is optimized for the industry's smallest unit pixel ※ 1 1.12μm 1)
Auto-focus lens module that employs a high-resolution lens F2.2 bright 2) ("IU135F3-Z")
Thin, compact 3) (W: realization ("IU134F9-Z" to 4.2mm ※ 4)): 8.5x D: 8.5x H
With signal processing functions 4) camera, all-in-one model with adjustable image quality ("IUS014F-Z")
Auto-focus lens module that employs a high-resolution lens F2.2 bright 2) ("IU135F3-Z")
Thin, compact 3) (W: realization ("IU134F9-Z" to 4.2mm ※ 4)): 8.5x D: 8.5x H
With signal processing functions 4) camera, all-in-one model with adjustable image quality ("IUS014F-Z")
Stacked CMOS image sensor Key Specifications
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Main Specifications Imaging Module
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※ When the press release, August 20, 2012 1.
※ In the Nagasaki Technology Center of Sony Semiconductor Co., Ltd. 2, are (dated June 22) announced the implementation of capital investment that aims to increase the production capacity of the CMOS image sensor stacked.
※ Based on the method of specifying the effective pixel image sensor 3.
Width ※ 4 (W), the depth (D), except for the flexible printed circuit board portion. Value Typ. Except tolerance.
※ and "Exmor RS"
Is a trademark of Sony Corporation.
※ In the Nagasaki Technology Center of Sony Semiconductor Co., Ltd. 2, are (dated June 22) announced the implementation of capital investment that aims to increase the production capacity of the CMOS image sensor stacked.
※ Based on the method of specifying the effective pixel image sensor 3.
Width ※ 4 (W), the depth (D), except for the flexible printed circuit board portion. Value Typ. Except tolerance.
※ and "Exmor RS"
Is a trademark of Sony Corporation.